A generalized modular redundancy scheme for enhancing fault tolerance of combinational circuits

Aiman H. El-Maleh, Feras Chikh Oughali*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

26 Scopus citations


Nano-scale devices are continuously shrinking, operating at lower voltages and higher frequencies. This makes them more susceptible to environmental perturbations and distinguished by their high dynamic fault rates. Redundancy techniques are widely used to increase the reliability of combinational logic circuits. In this work, soft error reliability is improved by using such techniques, and based on probability of occurrence for combinations at the outputs of circuits. A generalized modular redundancy scheme to enhance the reliability of combinational circuits is proposed. Additionally, several aspects regarding the application of this scheme are explored. This comprises types of redundant modules, complexity of voters and single versus multiple outputs protection. Also, a methodology for applying the generalized modular redundancy scheme is developed. Reliability analysis for various benchmarks from the LGSynth91 suite shows that the proposed methodology can achieve reliability figures higher than that of triple modular redundancy. In general, significant overhead savings are accomplished in addition to that superior reliability.

Original languageEnglish
Pages (from-to)316-326
Number of pages11
JournalMicroelectronics Reliability
Issue number1
StatePublished - Jan 2014

Bibliographical note

Funding Information:
This work is supported by King Fahd University of Petroleum & Minerals under Project# SB100006.

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Safety, Risk, Reliability and Quality
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering


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