Abstract
This study deals with the numerical evaluation of sandwich structures including various core geometries like, Corrugated, Hexagonal, Diamond, and Octagonal using finite element analysis (FEA) in ANSYS software. The main objective of the current study is to determine how core geometry impacts the mechanical behavior of sandwich structures under compressive loading. Three-dimensional models of each core type were developed in ANSYS SpaceClaim, meshed with appropriate refinement, and simulated under controlled boundary conditions to ensure consistency. Corrugated cardboard was employed as the material, modeled with orthotropic elastic and plastic properties derived from experimental data. Important parameters for the simulation included deformation, stress distribution, and reaction forces. This methodology allowed a systematic comparison of different core shapes while maintaining consistent material properties and loading scenarios. This study helps to the understanding of how geometric design impacts structural performance and offers a foundation for optimizing sandwich structure in lightweight and packaging applications. Results indicated that the diamond design obtained the best balance of stiffness, low deformation, and stress distribution, while the octagonal structure exhibited strong load resistance. whereas, hexagonal and corrugated structures exhibited higher deformation and stress concentrations, indicating lower strength.
| Original language | English |
|---|---|
| Title of host publication | 11th International Conference on Engineering and Emerging Technologies, ICEET 2025 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (Electronic) | 9798331567552 |
| DOIs | |
| State | Published - 2025 |
| Event | 11th International Conference on Engineering and Emerging Technologies, ICEET 2025 - Kuala Lumpur, Malaysia Duration: 22 Oct 2025 → 23 Oct 2025 |
Conference
| Conference | 11th International Conference on Engineering and Emerging Technologies, ICEET 2025 |
|---|---|
| Country/Territory | Malaysia |
| City | Kuala Lumpur |
| Period | 22/10/25 → 23/10/25 |
Bibliographical note
Publisher Copyright:© 2025 IEEE.
Keywords
- Finite Element Analysis (FEA)
- Lightweight design
- Packaging Applications
- Sandwich Structures
ASJC Scopus subject areas
- Software
- Signal Processing
- Instrumentation
- Engineering (miscellaneous)
- Hardware and Architecture
- Computer Science Applications
- Computer Networks and Communications
- Artificial Intelligence
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